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Samsung slims down NAND memory packaging, wafer-thin gadgets to follow

Source: Engadget

Nov 06, 2009

Summary

Good old Samsung and its obsession with thinness. After finally letting its 30nm 32Gb NAND chips out of the bag in May, the Korean memory maker has now successfully halved the thickness of its octa-die memory package to a shockingly thin 0.6mm (or 0.02 inches). The new stacks will start out at a 32GB size, though the real benefits are likelier to be felt down the line when the ability to pack bits more densely pays off in even higher storage capacities. Cellphones, media players and digital cameras will inevitably take the lion's share, but we're hopeful -- eternal optimists that we are -- that this could accelerate the decline of SSD prices to a borderline affordable level. Intel and Micron promised us as much, how about Samsung delivering it?

[Via Information Week]

Filed under: Storage

Samsung slims down NAND memory packaging, wafer-thin gadgets to follow originally appeared on Engadget on Fri, 06 Nov 2009 08:19:00 EST. Please see our terms for use of feeds.

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